Piramidal Case, for Computer, with High Ability to Dissipate the Heat

ABSTRACT

Pyramidal case for computer, with a square base including a support on a box, with a rectangular rear section and a trapezoidal front section, which dissipates the heat with greater efficiency and effectiveness, through obliged paths of the air flows which amplify the natural thermodynamics of the warm air masses. The study and the coercion of the air flows, applied to this invention, allow a greater dissipation of the heat with respect to any other existing case, which bases the cooling on directional air flows towards each component, but that inside the case itself, become chaotic and poorly efficient in the management of the whole generated heat.

The present invention relates to a pyramidal case, for computer, withhigh ability to dissipate the heat. The Pyramid with a square base,which has a support on a box, is obtained from the joining of threefundamental parts which are: base or container for local power source(FIG. 1), chassis or support for the components (FIG. 4) and cover (FIG.5).

These three parts, join respectively to each other, through implantationscrews and fitting flaps; these last ones are designed to render thecover easily interchangeable.

The case of the invention is illustrated in the five attached designs.

In FIG. 1 a) and FIG. 1 d) (from a lower point of view) the air intakeimpeller of the local power source and the respective incoming air floware illustrated, the air flow being pushed by the impeller and attracteddue to depression by the extraction impeller (FIG. 1 b), placed in thelateral part of the trapezoidal section of the container for the localpower source and the respective outgoing air flow, (FIG. 1 e) (from alower point of view).

FIGS. 1 f) and 1 c) show the air intake impeller directed to the insideof the case with the respective incoming air flow (from the outside tothe inside of the case).

FIG. 1 g) and FIG. 1 h) show, respectively, the recesses of the fittingflaps of the upper part of the case (FIG. 5) respectively in the rearpart and in the front part of the base of the pyramid. The cover of thelocal power source independently manages (being isolated) the air flowswith respect to the upper part of the pyramid, containing the other heatgenerating components.

FIG. 2 shows the vertical section of the case, from a rear view, whichillustrates the air flows.

FIG. 2 a shows the local power source impeller, FIG. 2 b shows theoutgoing air flow from the local power source section, FIG. 2 c showsthe incoming air impeller section for the inside of the case, FIG. 2 dshows the direction and the incoming air flow towards the inside of thecase.

FIG. 2 e shows an air flow deflector which divides, respectively, theair flow which goes to the mother board side (FIG. 2 f)) and the airflow which goes under the mother board (FIG. 2 g)) which allow the freshair mass crossing between the upper part of the slot-in reader and thelower part of the mother board.

The air flow deflectors (FIG. 2 h and FIG. 2 l) placed to the sides ofthe body of the cpu heat sink, thanks to the depression caused byaspiration of the impeller which is arranged above said heat sink (FIG.2 i), allow a considerable and effective air flow (FIG. 2 m)), which,going by force through the heat sink fins, cools the cpu and creates awarm air flow directed towards the grids placed on the apex of thepyramid made to eject the ascending warm air flow (FIG. 2 n))

FIG. 3 shows a vertical case section, with front view, which illustratesthe air flows. FIG. 3 a shows the air intake impeller for the inside ofthe case, FIG. 3 b shows an air flow deflector which dividesrespectively the air flow which goes to the side of the mother-board(FIG. 3 d and FIG. 3 f) and the air flow which goes under themother-board (FIG. 3 c) and in front of the frontal section of themother-board (FIG. 3 e) which allows the fresh air mass crossing betweenthe upper part of the slot-in reader and the lower part of themother-board.

The air flow deflectors (FIG. 3 h and FIG. 3 i) placed to the sides ofthe body of the heat sink of the cpu, thanks to the depression caused byaspiration of the impeller (FIG. 3 l) which is arranged above said heatsink (FIG. 3 g) allow a considerable and an effective air flow (FIG. 3m)), which, going by force through the heat sink fins (FIG. 3 g)), coolsthe cpu and creates warm air flow directed towards the grids placed onthe apex of the pyramid adapted to eject the ascending warm air flow(FIG. 3 n)).

FIG. 4 shows the chassis in plan view on which the inner components ofthe computer will be inserted and fixed.

FIGS. 4 a and 4 b show respectively the implantation screws of thechassis on the local power source container (FIG. 1).

In FIGS. 4 c), 4 e), 4 f), 4 g), 4 h), 4 i), 4 l) and 4 m) the fittingand fixing flaps of the inner components with these commoncharacteristics are shown: the outlined area shows the flap surfacewhich has an inclination of 90° with respect to the plane of thechassis, while the dotted surface of the flap, suitably bent, isparallel to the plane of the chassis.

FIGS. 4 c and 4 l show the hard disk fitting and fixing flaps.

FIGS. 4 e and 4 h show the mother-board fixing flaps.

FIGS. 4 f, 4 g, 4 i and 4 m show the reader slot-in fitting and fixingflaps.

FIG. 5 shows the upper part of the case, composed from two parts, FIG. 5g and FIG. 5 h (in plan view) and FIGS. 5 i and 5 l (in perspectiveview). FIG. 5 b shows the opening for the CD insertion FIG. 5 c showsthe opening for the mother-board interface. FIG. 5 a shows the flapswhich allow the connection of the structure (FIG. 5 g) on the base (FIG.1). FIG. 5 d shows the flaps which allow the connection to the base(FIG. 1). FIG. 5 e shows the flaps which allow the connection of thestructure (FIG. 5 h) to the structure (FIG. 5 g) at points (FIG. 5 f).

FIGS. 5 i) and 5 l) show, in perspective view, the two elements of theupper part of the case with the fixing flaps 5 m and 5 n on respectivepoints FIG. 1 g and FIG. 1 h.

FIG. 5 q shows one of the recesses for the flaps (FIG. 5 r) of the twoupper parts of the case (FIG. 5 i and FIG. 5 l). Moreover the air flowdeflectors (FIGS. 5 o and 5 p) are illustrated.

1-7. (canceled)
 8. A computer comprising a mother board, on which islocated a CPU; electric power means; and a case for housing at leastsaid mother board and said CPU; said computer being comprising an innerimpeller housed inside said case to generate an ascending air flow; aheat sink located beneath said inner impeller, and through which flowsthe air flow generated by the inner impeller; and one or more flowdeflectors housed inside said case, and which direct air from an inletopening, formed in said case and beneath said inner impeller, into saidheat sink; said heat sink being positioned contacting, to ensure coolingof, said CPU; and an air outlet opening being formed in said case, oversaid inner impeller.
 9. A computer as claimed in claim 8, comprising asecond impeller located at said air inlet opening.
 10. A computer asclaimed in claim 9, comprising further flow deflectors housed in saidcase and arranged to ensure the air flow generated by said innerimpeller flows over the mother board.
 11. A computer as claimed in claim10, wherein said further flow deflectors are arranged to ensure the airflow generated by said inner impeller flows over all the electroniccomponents.
 12. A computer as claimed in claim 8, comprising a secondcase housing said electric power means.